BONDING – RESING COATING – SUPPORT
ISEPOX® BOND 226
Two-component, tixotropic, anti-mold epoxy based product for bonding and resin coating.
Component A: epoxy resin with inorganic fillers, thixotropic.
Component B: modified amino hardener with inorganic fillers, thixotropic.
USE: bonding of different materials. Adhesive for assembling ceramic parts, natural stone and stone materials.
Produced in USA designed in Italy.
The WEDI® building board has a blue foam core rigid extruded polystyrene.
The rigid foam is armed on both the sides with fiberglass fabric, (with sanding resistant finish alkalis) and covered on both sides with cement mortar modified polymer.
Sealing with special glues, bi-component anti-mold thixotropic resin coating.
Slightly shapes edges Porcelain stoneware with multiple finishes: marble, stone, wood, concrete etc.